Beam manipulation devices meant for ultrafast applications. Some products for ultrafast product line were designed to have thin dielectric thickness to minimize dispersion and make them suitable for use with sub 50 fs pulses.
Products that feature low absorption optical coatings and which optomechanical design was engineered to address demand for high LIDT and optics longevity under high average power and pulse repetition rates.
Solutions for medium power lasers consisting of both classical zoom objectives to complex beam shaping solutions. Medium power applications are mainly in microprocessing - drilling, scribing, writing in volume, engraving, etc.